In modern electronics manufacturing, BGA PCB Assemblyanois ar cheann de na teicneolaíochtaí pacáistithe is iontaofa agus is éifeachtaí le haghaidh feistí dlúth. Leis an gcumas chun tacú le comhpháirteanna ard-chomhaireamh bioráin, feidhmíocht theirmeach feabhsaithe, agus joints solder cobhsaí, úsáidtear é go forleathan i dtrealamh cumarsáide, leictreonaic tomhaltóra, córais rialaithe tionsclaíocha, agus leictreonaic feithicleach. De réir mar a fhorbraíonn an teicneolaíocht i dtreo miniaturization agus ardfheidhmíochta, is maith le cuideachtaíShenzhen Fanway Technology Co., Ltd. provide advanced BGA PCB Assembly solutions that ensure optimal quality, precision, and durability.
Úsáideann feistí BGA (Eagar Eangaí Liathróid) liathróidí sádrála atá socraithe i ngreille faoin gcomhpháirt in ionad bioráin atá suite ar an imlíne. Tá roinnt buntáistí tábhachtacha ag baint leis an difríocht struchtúrach seo:
Higher connection density
Better electrical conductivity
Enhanced heat dissipation
Superior performance stability
Reduced risk of solder bridging
This technology is especially valuable when your product requires more robust signal integrity and tighter packaging than conventional SMD components can deliver.
The application of BGA PCB Assemblycuireann sé go mór le feidhmíocht iomlán an fheiste. Giorraíonn a liathróidí solder i bhfolach cosáin leictreacha, ag ísliú friotaíocht agus feabhas a chur ar luas tarchurtha comhartha. Ina theannta sin, cuireann an limistéar teagmhála níos mó de na liathróidí solder le seoltacht teasa, rud a ligeann do sceallóga agus próiseálaithe ardchumhachta fanacht cobhsaí le linn oibriú fadtéarmach. I gcás tionscail a dteastaíonn leictreonaic iontaofa agus dhlúth uathu, bíonn an modh tionóil seo fíor-riachtanach.
Key Performance Benefits:
Lower impedance and improved high-frequency performance
Strong mechanical connection for vibration-resistant applications
Excellent thermal management
Increased processing capability for CPUs, GPUs, and ICs
Below is an overview of the manufacturing parameters supported by Shenzhen Fanway Technology Co., Ltd. for BGA PCB Assembly.
1. Assembly Capability Overview
| Parameter Category | Specification |
|---|---|
| Package Types | BGA, Micro-BGA, CSP, LGA, QFN |
| Ball Pitch | 0.25 mm – 1.27 mm |
| Min. PCB Thickness | 0.4 mm |
| Max. PCB Size | 510 mm × 510 mm |
| Assembly Types | Leaded / Lead-free BGA |
| Inspection Method | X-ray, AOI, Functional Testing |
| Rework Capability | BGA removal, reballing, replacement |
2. Soldering & Inspection Parameters
Reflow Temperature Control: ±1°C accuracy
Voids Rate: < 10% (optimized for premium applications)
Coplanarity Tolerance: < 0.1 mm
Alignment Precision: ±20 μm
Placement Accuracy: Up to 01005 components supported alongside BGA
3. PCB Material Compatibility
FR4 High-Tg
Polyimide (PI)
Rogers high-frequency boards
Hybrid multilayer PCBs
HDI boards with blind/buried vias
Cinntíonn na paraiméadair seo tionól cobhsaí, in-athdhéanta agus ardchruinneas do na tionscadail BGA is casta fiú.
Industries that require precision, durability, and high component density consistently choose BGA PCB Assembly because it ensures:
Minimal signal delay
Long-term thermal stability
Strong mechanical bonding
Low failure rate under continuous operation
Excellent EMC performance
Industries Widely Applying BGA PCB Assembly:
Consumer electronics (smartphones, tablets, laptops)
Industrial control equipment
Automotive electronics and navigation systems
Medical electronics
Network communication devices
Aerospace and defense electronics
Cuireann Shenzhen Fanway Technology Co., Ltd réitigh BGA in oiriúint chun freastal ar na coinníollacha éilitheacha tionscail seo.
Braitheann iontaofacht go mór ar rialú próisis, ar theicneolaíocht iniúchta, agus ar shaineolas innealtóireachta. Fostaimid:
Quality Control Measures:
Automated Optical Inspection (AOI)
Detects slight misalignment, solder defects, and component orientation issues.
X-ray Inspection
Essential for hidden solder joints under BGA packages.
Checks for voids, bridging, insufficient solder, and open connections.
Reflow Profiling Optimization
Ensures solder balls fully melt and form uniform connections.
Professional Rework Technology
Our engineers can safely replace, reball, and realign BGA components without damaging the PCB.
Cinntíonn na teicníochtaí seo go gcomhlíonann gach bord caighdeáin cháilíochta domhanda mar IPC-A-610 agus ISO9001.
The true value of BGA PCB Assembly lies in its ability to help engineers design products that are:
Smaller
Faster
More energy-efficient
More reliable under harsh conditions
Toisc go suíonn pacáistí BGA go díreach os cionn liathróidí solder, giorraíonn cosáin leictreacha agus laghdaítear an fhriotaíocht. Tá an struchtúr seo oiriúnach do tháirgí a dteastaíonn próiseáil tapa sonraí nó leagan amach inmheánach dlúth. Mar shampla, baineann feistí a úsáideann CPUanna, sliseanna cuimhne, modúil Bluetooth, nó ICanna líonraithe chun cinn go mór leas as tionól BGA.
Chun an fheidhmíocht is fearr a chinntiú, ba cheart d’innealtóirí na nithe seo a leanas a mheas:
Design Considerations:
Adequate pad diameter
Proper solder mask design
Via-in-pad structure if necessary
PCB heat distribution
Reflow curve configuration
Suitable material and layer count
Production Considerations:
The precision of placement equipment
X-ray inspection capability
Engineering experience with high-density designs
Rework and repair capability
Soláthraíonn Shenzhen Fanway Technology Co., Ltd tacaíocht innealtóireachta cuimsitheach, ag cabhrú leat leagan amach a bharrfheabhsú, riosca cóimeála a laghdú, agus toradh déantúsaíochta a fheabhsú.
Q1: What is BGA PCB Assembly and why is it widely used?
A:Is modh é Tionól PCB BGA chun comhpháirteanna Eagar Eangaí Liathróid a shuiteáil ar chláir chiorcaid phriontáilte ag baint úsáide as liathróidí solder atá socraithe faoin bpacáiste. Úsáidtear go forleathan é toisc go soláthraíonn sé naisc ard-dlúis, feidhmíocht leictreach cobhsaí, agus diomailt teasa den scoth, atá riachtanach le haghaidh feistí leictreonacha dlúth nua-aimseartha.
Q2: How does BGA PCB Assembly improve the reliability of my product?
A: Its structure creates strong mechanical connections and improves thermal conduction. These factors reduce failure rates, enhance performance stability, and allow the PCB to operate efficiently under continuous high-load conditions.
Q3: What inspections are needed during BGA PCB Assembly?
A:Tá cigireacht X-gha éigeantach chun hailt solder folaithe a fhíorú. Moltar AOI agus tástáil fheidhmiúil freisin chun cruinneas ailínithe, sádráil cheart, agus feidhmíocht leictreach a chinntiú.
Q4: Can Shenzhen Fanway Technology Co., Ltd. handle complex BGA PCB Assembly projects?
A:Tá. Tacaímid le boird fíneáil-pháirc BGA, Micrea-BGA, CSP, agus HDI le socrúcháin ardchruinneas, rialú athshreabhadh, tástáil X-gha, agus cumais athoibrithe, rud a fhágann gur comhpháirtí iontaofa sinn le haghaidh seirbhísí cóimeála BGA lán-raon.
If your project requires stable, high-precision, and high-performance BGA PCB Assembly, tá ár bhfoireann innealtóireachta réidh chun tacú le d'fhorbairt ó fhréamhshamhail go olltáirgeadh.
For more information or technical consultation, please contact Shenzhen Fanway Technology Co., Ltd. — your trusted partner in advanced electronic manufacturing.
